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1. general description the 74hc4024 is a high-speed si-gate cmos de vice and is pin compatible with the 4024 of the 4000b series. the 74hc4024 is specified in compliance with jedec standard no. 7a. the 74hc4024 is a 7-stage binary ripple counter with a clock input (cp ), an overriding asynchronous master reset input (mr) and seven fully buffered pa rallel outputs (q0 to q6). the counter advances on t he high-to-low transition of cp . a high on mr clears all counter stages and forces all outputs low, independent of the state of cp . each counter stage is a static toggle flip-flop. schmitt-trigger action in the clock input makes the circuit highly tolerant to slower clock rise and fall times. 2. features and benefits ? low-power dissipation ? complies with jedec standard no. 7a ? esd protection: ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115-a exceeds 200 v. ? multiple package options ? specified from ? 40 cto+80 c and from ? 40 cto+125 c. 3. applications ? frequency dividing circuits ? time delay circuits. 74hc4024 7-stage binary ripple counter rev. 4 ? 29 september 2010 product data sheet
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 2 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter 4. ordering information 5. functional diagram table 1. ordering information type number package temperature range name description version 74HC4024N ? 40 c to +125 c dip14 plastic dual in-line package; 14 leads (300 mil) sot27-1 74hc4024d ? 40 c to +125 c so14 plastic small outl ine package; 14 leads; body width 3.9 mm sot108-1 74hc4024db ? 40 c to +125 c ssop14 plastic shrink small outline package; 14 leads; body width 5.3 mm sot337-1 74hc4024pw ? 40 c to +125 c tssop14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 fig 1. logic symbol fig 2. functional diagram fig 3. iec logic symbol 001aab906 mr 2 q0 q1 q2 q3 q4 q5 q6 3 4 5 6 9 11 12 cp 1 001aab908 mr q3 q4 q5 q6 6 5 4 3 7-stage counter q0 q1 q2 12 11 9 2 cp 1 001aab907 ct = 0 ct 2 0 6 3 4 5 6 9 11 12 ctr7 + 1 fig 4. logic diagram 001aab90 9 rd ff 1 t cp q q mr rd ff 2 t q q rd ff 3 t q q rd ff 4 t q q rd ff 5 t q q rd ff 6 t q q rd q0 q1 q2 q3 q4 q5 q6 ff 7 t q q
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 3 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter 6. pinning information 6.1 pinning 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; = low-to-high clock transition; = high-to-low clock transition. fig 5. pin configuration 74hc4024 cp v cc mr n.c. q6 q0 q5 q1 q4 n.c. q3 q2 gnd n.c. 001aab905 1 2 3 4 5 6 7 8 10 9 12 11 14 13 table 2. pin description symbol pin description cp 1 clock input (high-to-low, edge-triggered) mr 2 master reset input (active high) q6, q5, q4, q3, q2, q2, q1, q0 3, 4, 5, 6, 9, 11, 12 parallel output gnd 7 ground (0 v) n.c. 8, 10, 13 not connected v cc 14 positive supply voltage table 3. function table [1] input output mr cp qn hxl l no change count
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 4 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter 8. limiting values [1] for dip16 package: p tot derates linearly with 12 mw/k above 70 c. [2] for so16 package: p tot derates linearly with 8 mw/k above 70 c. [3] for (t)ssop16 packages: p tot derates linearly with 5.5 mw/k above 60 c. 9. recommended operating conditions table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +7 v i ik input clamping current v i < ? 0.5 v or v i >v cc +0.5 v - 20 ma i ok output clamping current v o < ? 0.5 v or v o >v cc +0.5v - 20 ma i o output current v o = ? 0.5 v to v cc +0.5v - 25 ma i cc supply current - 50 ma i gnd ground current ? 50 - ma t stg storage temperature ? 65 +150 c p tot total power dissipation dip14 package [1] - 750 mw so14 package [2] - 500 mw ssop14 and tssop14 package [3] - 500 mw table 5. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 2.0 5.0 6.0 v v i input voltage 0 - v cc v v o output voltage 0 - v cc v t/ v input transition rise and fall rate v cc = 2.0 v - - 625 ns/v v cc = 4.5 v - 1.67 139 ns/v v cc = 6.0 v - - 83 ns/v t amb ambient temperature ? 40 - +125 c
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 5 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter 10. static characteristics table 6. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit t amb =25 c v ih high-level input voltage v cc = 2.0 v 1.5 1.2 - v v cc = 4.5 v 3.15 2.4 - v v cc = 6.0 v 4.2 3.2 - v v il low-level input voltage v cc =2.0v - 0.8 0.5 v v cc =4.5v - 2.1 1.35 v v cc =6.0v - 2.8 1.8 v v oh high-level output voltage v i =v ih or v il i o = ? 20 a; v cc =2.0v 1.9 2.0 - v i o = ? 20 a; v cc =4.5v 4.4 4.5 - v i o = ? 20 a; v cc =6.0v 5.9 6.0 - v i o = ? 4ma; v cc = 4.5 v 3.98 4.32 - v i o = ? 5.2 ma; v cc = 6.0 v 5.48 5.81 - v v ol low-level output voltage v i =v ih or v il i o =20 a; v cc =2.0v - 0 0.1 v i o =20 a; v cc =4.5v - 0 0.1 v i o =20 a; v cc =6.0v - 0 0.1 v i o =4ma; v cc = 4.5 v - 0.15 0.26 v i o =5.2ma; v cc = 6.0 v - 0.16 0.26 v i i input leakage current v i =v cc or gnd; v cc =6.0v - - 0.1 a i cc supply current v i =v cc or gnd; i o =0a; v cc = 6.0 v - - 8.0 a c i input capacitance - 3.5 - pf t amb = ? 40 c to +85 c v ih high-level input voltage v cc = 2.0 v 1.5 - - v v cc = 4.5 v 3.15 - - v v cc = 6.0 v 4.2 - - v v il low-level input voltage v cc =2.0v --0.5v v cc =4.5v --1.35v v cc =6.0v --1.8v v oh high-level output voltage v i =v ih or v il i o = ? 20 a; v cc =2.0v 1.9--v i o = ? 20 a; v cc =4.5v 4.4--v i o = ? 20 a; v cc =6.0v 5.9--v i o = ? 4ma; v cc = 4.5 v 3.84 - - v i o = ? 5.2 ma; v cc = 6.0 v 5.34 - - v
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 6 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter v ol low-level output voltage v i =v ih or v il i o =20 a; v cc =2.0v --0.1v i o =20 a; v cc =4.5v --0.1v i o =20 a; v cc =6.0v --0.1v i o =4ma; v cc = 4.5 v - - 0.33 v i o =5.2ma; v cc = 6.0 v - - 0.33 v i i input leakage current v i =v cc or gnd; v cc =6.0v - - 1.0 a i cc supply current v i =v cc or gnd; i o =0a; v cc =6.0v --80 a t amb = ? 40 c to +125 c v ih high-level input voltage v cc = 2.0 v 1.5 - - v v cc = 4.5 v 3.15 - - v v cc = 6.0 v 4.2 - - v v il low-level input voltage v cc =2.0v --0.5v v cc =4.5v --1.35v v cc =6.0v --1.8v v oh high-level output voltage v i =v ih or v il i o = ? 20 a; v cc =2.0v 1.9--v i o = ? 20 a; v cc =4.5v 4.4--v i o = ? 20 a; v cc =6.0v 5.9--v i o = ? 4ma; v cc = 4.5 v 3.7 - - v i o = ? 5.2 ma; v cc = 6.0 v 5.2 - - v v ol low-level output voltage v i =v ih or v il i o =20 a; v cc =2.0v --0.1v i o =20 a; v cc =4.5v --0.1v i o =20 a; v cc =6.0v --0.1v i o =4ma; v cc = 4.5 v - - 0.4 v i o =5.2ma; v cc = 6.0 v - - 0.4 v i i input leakage current v i =v cc or gnd; v cc =6.0v - - 1.0 a i cc supply current v i =v cc or gnd; i o =0a; v cc =6.0v --160 a table 6. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 7 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter 11. dynamic characteristics table 7. dynamic characteristics gnd = 0 v; t r =t f =6 ns; c l = 50 pf; see figure 7 . symbol parameter conditions min typ max unit t amb = 25 c t pd propagation delay cp to q0; see figure 6 [1] v cc = 2.0 v - 47 175 ns v cc = 4.5 v - 17 35 ns v cc = 6.0 v - 14 30 ns v cc =5.0v; c l =15pf - 14 - ns qn to qn+1; see figure 6 [1] v cc = 2.0 v - 25 80 ns v cc = 4.5 v - 9 16 ns v cc = 6.0 v - 7 14 ns t phl high to low propagation delay mr to q0; see figure 6 v cc = 2.0 v - 63 200 ns v cc = 4.5 v - 23 40 ns v cc = 6.0 v - 18 34 ns t t transition time see figure 6 [2] v cc = 2.0 v - 19 75 ns v cc = 4.5 v - 7 15 ns v cc = 6.0 v - 6 13 ns t w pulse width cp high or low; see figure 6 v cc = 2.0 v 8017- ns v cc = 4.5 v 16 6 - ns v cc = 6.0 v 14 5 - ns mr high; see figure 6 v cc = 2.0 v 8022- ns v cc = 4.5 v 16 8 - ns v cc = 6.0 v 14 6 - ns t rec recovery time mr to cp ; see figure 6 v cc = 2.0 v 50 6 - ns v cc = 4.5 v 10 2 - ns v cc = 6.0 v 9 2 - ns f max maximum frequency cp; see figure 6 v cc = 2.0 v 6.0 27 - mhz v cc = 4.5 v 3082- mhz v cc = 6.0 v 3598- mhz v cc =5.0v; c l =15pf - 90 - mhz c pd power dissipation capacitance v i = gnd to v cc [3] -25-pf
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 8 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter t amb = ? 40 c to +85 c t pd propagation delay cp to q0; see figure 6 [1] v cc = 2.0 v - - 220 ns v cc = 4.5 v --44ns v cc = 6.0 v --37ns qn to qn+1; see figure 6 [1] v cc = 2.0 v - - 100 ns v cc = 4.5 v --20ns v cc = 6.0 v --17ns t phl high to low propagation delay mr to q0; see figure 6 v cc = 2.0 v - - 250 ns v cc = 4.5 v --50ns v cc = 6.0 v --43ns t t transition time see figure 6 [2] v cc = 2.0 v --95ns v cc = 4.5 v --19ns v cc = 6.0 v --16ns t w pulse width cp high or low; see figure 6 v cc = 2.0 v 100 - - ns v cc = 4.5 v 20--ns v cc = 6.0 v 17--ns mr high; see figure 6 v cc = 2.0 v 100 - - ns v cc = 4.5 v 20--ns v cc = 6.0 v 17--ns t rec recovery time mr to cp ; see figure 6 v cc = 2.0 v 65--ns v cc = 4.5 v 13--ns v cc = 6.0 v 11--ns f max maximum frequency cp; see figure 6 v cc = 2.0 v 4.8--mhz v cc = 4.5 v 24--mhz v cc = 6.0 v 28--mhz table 7. dynamic characteristics ?continued gnd = 0 v; t r =t f =6 ns; c l = 50 pf; see figure 7 . symbol parameter conditions min typ max unit
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 9 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter t amb = ? 40 c to +125 c t pd propagation delay cp to q0; see figure 6 [1] v cc = 2.0 v - - 265 ns v cc = 4.5 v --53ns v cc = 6.0 v --45ns qn to qn+1; see figure 6 [1] v cc = 2.0 v - - 120 ns v cc = 4.5 v --24ns v cc = 6.0 v --20ns t phl high to low propagation delay mr to q0; see figure 6 v cc = 2.0 v - - 300 ns v cc = 4.5 v --60ns v cc = 6.0 v --51ns t t transition time see figure 6 [2] v cc = 2.0 v - - 110 ns v cc = 4.5 v --22ns v cc = 6.0 v --19ns t w pulse width cp high or low; see figure 6 v cc = 2.0 v 120 - - ns v cc = 4.5 v 24--ns v cc = 6.0 v 20--ns mr high; see figure 6 v cc = 2.0 v 120 - - ns v cc = 4.5 v 24--ns v cc = 6.0 v 20--ns t rec recovery time mr to cp ; see figure 6 v cc = 2.0 v 75--ns v cc = 4.5 v 15--ns v cc = 6.0 v 13--ns table 7. dynamic characteristics ?continued gnd = 0 v; t r =t f =6 ns; c l = 50 pf; see figure 7 . symbol parameter conditions min typ max unit
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 10 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter [1] t pd is the same as t plh and t phl . [2] t t is the same as t thl and t tlh . [3] c pd is used to determine the dynamic power dissipation (p d in w). p d =c pd v cc 2 f i n+ (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; (c l v cc 2 f o ) = sum of outputs. 12. waveforms f max maximum frequency cp; see figure 6 v cc = 2.0 v 4.0--mhz v cc = 4.5 v 20--mhz v cc = 6.0 v 24--mhz table 7. dynamic characteristics ?continued gnd = 0 v; t r =t f =6 ns; c l = 50 pf; see figure 7 . symbol parameter conditions min typ max unit also showing the master reset (mr) pulse width, the master reset to output (qn) propagation delays and the master reset to clock (cp ) recovery time. v m = 0.5 v i . fig 6. waveforms showing the clock (cp ) to output (qn) propagation delays, the clock pulse width, the output transition times and the maximum clock frequency mr input cp input q0 or qn output t w t phl 1/f max t rec v m v m 001aab91 0 t plh t w t tlh t thl t phl v m
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 11 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter test data is given in table 8 . definitions for test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. fig 7. test circuit for measuring switching times mna10 1 v cc v i v o r t c l pulse generator dut table 8. test data supply input load v cc v i t r , t f c l 2.0 v v cc 6 ns 50 pf 4.5 v v cc 6 ns 50 pf 6.0 v v cc 6 ns 50 pf 5.0 v v cc 6 ns 15 pf
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 12 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter 13. package outline fig 8. package outline sot27-1 (dip14) unit a max. 1 2 (1) (1) b 1 cd (1) z ee m h l references outline version european projection issue date iec jedec jeita mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot27-1 99-12-27 03-02-13 a min. a max. b max. w m e e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.087 0.17 0.02 0.13 050g04 mo-001 sc-501-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 14 1 8 7 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. d ip14: plastic dual in-line package; 14 leads (300 mil) sot27 -1
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 13 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter fig 9. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale s o14: plastic small outline package; 14 leads; body width 3.9 mm sot108 -1
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 14 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter fig 10. package outline sot337-1 (ssop14) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 0.2 7.9 7.6 1.03 0.63 0.9 0.7 1.4 0.9 8 0 o o 0.13 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot337-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 1 7 14 8 a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale s sop14: plastic shrink small outline package; 14 leads; body width 5.3 mm sot337 -1 a max. 2
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 15 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter fig 11. package outline sot402-1 (tssop14) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot402-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 17 14 8 a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402 -1 a max. 1.1 pin 1 index
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 16 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter 14. abbreviations 15. revision history table 9. abbreviations acronym description cmos complementary metal-oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model table 10. revision history document id release date data sheet status change notice supersedes 74hc4024 v.4 20100929 product data sheet - 74hc4024 v.3 modifications: ? the format of this data sheet has been re designed to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? figure 1 : inversion dot removed for mr pin. ? ta b l e 4 : derating factor changed for (t)ssop14 packages. ? ta b l e 5 : t r , t f changed to t/ v. 74hc4024 v.3 20041112 product data sheet - 74hc_hct4024_cnv v.2 74hc_hct4024_cnv v.2 19970901 product specification - 74hc_hct4024 v.1 74hc_hct4024 v.1 19901201 pr oduct specification - -
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 17 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
74hc4024 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 4 ? 29 september 2010 18 of 19 nxp semiconductors 74hc4024 7-stage binary ripple counter export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74hc4024 7-stage binary ripple counter ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 29 september 2010 document identifier: 74hc4024 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 17 contact information. . . . . . . . . . . . . . . . . . . . . 18 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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